Workshop

Thermal Simulation Workshop

Learn how to improve your product design with thermal analysis

About this workshop

Heat transfer is an important characteristic of many products across a variety of different industries. The SimScale Thermal Analysis Workshop is a free course that teaches mechanical designers and engineers how to use thermal simulation in the web browser for optimizing cooling and heating processes for improved energy efficiency and durability.

During the three, 1-hour long sessions held online on Tuesdays, you will learn the fundamentals of thermal analysis for modern product design and expand your knowledge based on practical examples of conduction, convection and radiation simulations.

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Session 1 - Basics of Heat Transfer and Thermal Simulation

September 27th 2016 4:00 p.m. CET / 10:00 a.m. EST

In this session, the three basic heat transfer mechanisms will be explained: Conduction, Convection, and Radiation . We will use 3 simple example simulations to better understand the influencing factors on a heat transfer process. We’ll then use this basic understanding to run a thermal analysis of a CFL to see how thermal simulation works for real-world problems.

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Session 2 - Conduction: Thermal Analysis of a LED

October 4th 2016 4:00 p.m. CET / 10:00 a.m. EST

In this session, we’ll use simulation to select the best heat sink design for an LED lighting system: focusing on conduction, we’ll compare a cooling performance of plate fin, inline pin fin, and staggered-pin fin. Afterward, we’ll analyze the structural effects of a thermal load on a spark plug by running a thermomechanical analysis of different designs.

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Session 3 - Convection: Cooling of Electronics

October 11th 2016 4:00 p.m. CET / 10:00 a.m. EST

In the third session of the Thermal Simulation Workshop from SimScale we were looking at convective heat transfer in fluids. The use case demonstrated the effect of natural and forced cooling on a Raspberry Pi motherboard. The case highlighted how convection makes a difference in keeping electronic components at operating temperatures inside the casing.

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