Thermal management through cloud-based CFD to test, validate, and optimize electronics designs iteratively and easily
Electronics cooling, or thermal management of electronics, whether it be the whole system or individual components within a PCB, is one of the most critical tasks within the design process. Engineers must integrate the prediction of critical temperatures as a part of the design lifecycle of their product. The main challenge is to keep every electronic component within the operational limits set by the manufacturers, to guarantee the reliable and safe operation of the system.
The electronics industry is one of the most rapidly growing industries in the world, but it is faced with increasingly stringent thermal design requirements, creating a demand for innovative and sustainable electronics cooling solutions. The growing popularity of high-powered electronics imposes various constraints on the designers, particularly in relation to temperature, size, weight, widely varying operating limits, and the multiple design scenarios that they must address within their tight schedules.
Operational limits for electronic designs can include but are not limited to:
Thermal integrity is one of the most important considerations for electronic packaging that affects their product lifecycle. The thermal impact is a key factor for material selection, as well as informing cooling and form factor decisions that determine the weight, size, and cost of the end-stage design.
Accurately predicting temperature distribution used to be considered an unattainable goal when dealing with complex and detailed models. These values could only be partially evaluated using built prototypes, full-scale experiments, worst-case scenario estimation, and approximated design rules. Through the power of the cloud, SimScale allows engineers to quickly and efficiently evaluate and improve electronic thermal environments, ultimately speeding up the iterative electronics cooling design process as a whole.
This public thermal management project shows how an enclosure for an industrial application of a GPU can be cooled via an active fan. This project shows how engineers can test and employ different cooling strategies, iterate quickly, and ultimately employ an effective solution.
Light-emitting diodes (LED) are an efficient lighting solution, as their output slowly diminishes over time. Throughout their lifetime, very often over the 50K hour mark, most will continue to emit light until it diminishes to a small flicker, indicating that it needs replacing.
This simulation determines whether or not the temperature of the LED board is below the recommended temperature of 40°C when a water-cooling thermal management strategy is employed. Find out if acceptable thermal conditions are met in this public project from SimScale.
This simulation project shows how the design of a programmable heating mantle medical device can be optimized through assessing the thermal management through thermodynamic simulation using SimScale. This equipment is typically used in laboratories to heat up containers of fluid in a homogeneous and controlled way. Learn more now.
In this electronics cooling SimScale project, a conjugate heat transfer analysis is used to predict the temperature of 30 commercial Li-ion 18650 cells under multiple casing designs and inlet flow conditions. The goal is to find the minimum cooling power. Find out more about this public SimScale project.
“Our overall impression of working with SimScale on our project is two thumbs way up. We’re already using it on new projects, and expect SimScale to be part of all future product developments. ”