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IBM - Cooling Raspberry pi - Demo

Thermal Plume - PostProcessorScreenshot

Thermal Plume - PostProcessorScreenshot

2D

Temperature Bottom View - PostProcessorScreenshot

2D

Temperature Top View - PostProcessorScreenshot

2D

Temperature - PostProcessorScreenshot

2D

Cutting plane - PostProcessorScreenshot

2D

Temperature Bottom View - PostProcessorScreenshot

2D

Temperature Top View - PostProcessorScreenshot

2D

Cutting plane - PostProcessorScreenshot

2D

Temperature Bottom View - PostProcessorScreenshot

2D

Temperatur View - PostProcessorScreenshot

2D

2743

109

Created

almost 3 years ago

Last modified

over 1 year ago

Statistics

1 Geometry

1 Mesh

2 Simulation setups

4 Results

About this project

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on.

conjugate heat transfer electronics cooling natural convection electronic design electronics enclosure forced convection cooling fan ibm cartesian mesh immersed boundary method

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Project History

Templates created this project
almost 3 years ago

IBM - Cooling Raspberry pi - Demo by Templates | SimScale