IBM - Cooling Raspberry pi - Demo - Copy

Thermal Plume - PostProcessorScreenshot
Thermal Plume - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperature Bottom View - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperature Top View - PostProcessorScreenshot
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2D
Temperature - PostProcessorScreenshot
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2D
Cutting plane - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperature Bottom View - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperature Top View - PostProcessorScreenshot
PostProcessorScreenshot
2D
Cutting plane - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperature Bottom View - PostProcessorScreenshot
PostProcessorScreenshot
2D
Temperatur View - PostProcessorScreenshot
PostProcessorScreenshot
2D
views 139
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lsayed
Created

about 2 years ago

Last modified

about 2 years ago

Statistics
geometries 1 Geometry
meshes 1 Mesh
simulations 3 Simulation setups
runs 4 Results

About this project

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on. - Copy

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IBM - Cooling Raspberry pi - Demo - Copy by lsayed | SimScale