Thermal Analysis of an Electronics Enclosure: Forced Convection Simulation

Thermal Analysis of an Electronics Enclosure: Forced Convection Simulation

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In this webinar, you will learn how to run heat transfer simulations to investigate forced convection cooling in an electronic enclosure, all by running your simulations from a web browser.

SimScale offers multiple analysis types for engineering simulation including conjugate heat transfer (CHT) capabilities coupling solid and fluid domains. SimScale also leverages automated parallel computation capabilities in the cloud to yield:

Our simulation specialists guide you through evaluating the forced convection cooling performance of an enclosure design. Key design considerations that are explored include: velocity and temperature distributions across the electronics components and their dependence on ventilator inlet speeds as well as two different heat sink designs.

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About SimScale

SimScale is the world’s first cloud-native SaaS engineering simulation platform, giving engineers and designers immediate access to digital prototyping early in the design stage, throughout the entire R&D cycle, and across the entire enterprise. By providing instant access to a single fluid, thermal, and structural simulation tool built on the latest cloud computing technology, SimScale has moved high-fidelity physics simulation technology from a complex and cost-prohibitive desktop application to a user-friendly web application, accessible to any designer and engineer in the world.