Please I need to cool down my PCB how can i make the air flow for this pcb
Hello, and thanks for using the Forum.
It appears to be you are using a Heat Transfer simulation type which is used to compute the temperature distribution only in solids. While using this analysis type fluid-solid thermal interaction can not be directly simulated, but it can only be mimicked by using boundary conditions.
Since you are also interested in simulating the airflow, Conjugate Heat Transfer simulation is the correct type in which fluid-solid thermal interaction can be simulated by using contacts.
Here you can find several public simulations that are performed with the Conjugate Heat Transfer type and that are similar to your own application.
I hope these are helpful,
Kaan.