I am seeking to demonstrate if which method, sucking air into a casing or blowing air outside the casing is more effective in lowering the temperature of a chip in Raspberry pi…
Firstly, my simulation is showing heat distribution only in a plane that is in the middle. Is there a way to show heat distribution in 3D for the whole fluid instead of a plane?
Secondly, I would like to show the heat flow moving where mine is stagnant.
Lastly, despite the chip having temperature of 80 degrees celsius , why the heat is not being transferred to the fluid which is air in this case. Is there a way to solve this issue.
You can see the red part which is the chip but region around it is blue.
***Please look at Run 2
FinalTrial | SimScale Workbench