Status - WIP
The cooling mechanism is very crucial to ensure the rated performance of CPU, at the same time it accounts for the major operating cost of the system. Therefore, an efficient electronics cooling is necessary to provide the continuous operations at low operating costs. Tools of computational Fluid Dynamics are widely being used to optimize the cooling mechanism of the chips. In this study the focus is on finding the optimum heat sink design for electronics cooling.
More detailed description and different simulation scenarios are given in the proposed paper .
CPU: 3.5mm x 30mm x 30mm
Heat Sink Base Plate: 3.5mm x 54mm x 65mm
Fin height: 40mm
Fin Pitch: 2.5mm
CPU Power rating: 80W
Inlet Flow rate: 30ft^3/min
Fig.1 The plate heat sink in two arrays.
The purpose of this project is to validate the accuracy of the SimScale CHT solver for electronics cooling. Different heat sinks, along with different base plates will be compared in order to find the best heat sink for the CPU cooling. The heat sink temperature difference results are to be compared with proposed experimental result to find out best heat sink designs.
Fig.2 a),b)Temperature distribution for different heat sinks with different base plates.
Computational Fluid Dynamics, desktop computer, heat sink, plate and cylindrical Heat Sink, CHT, conjugate heat transfer