Electronics Enclosure Design

Hi,
I am running a similar analysis. My electronics enclosure is sealed without any inlet and outlet. Air will be trapped inside and there will be some convection due to buoyancy. If you refer to the webinar at the following link, it refers to a similar case but the project is not available on Simscale. Could you advise, how to define the convection internally in an enclosure without any inlet and outlet. The link to the tutorial is Better Electronics Enclosure Design with Thermal Simulation - YouTube
Regards
Usman

Hey there Usman, and welcome to the forum!

I have to ask, by CHT are you referring to Convective or Conjugate Heat Transfer?

Basically the difference is that Conjugate HT also solves the solids on top of the fluid regions. By your description, I guess this is what you want. Here you can find more details:

On to your question: If you use this type of simulation, the buoyancy is automatically taken into account.

You might want to perform a setup similar to the one shown in this tutorial, just without the inlet/outlets modeling:

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