I have a simple thermal analysis ongoing. It’s a tpa3116 class D chip amp. I have been in contact with TI and their specialists say the temperature of the chip with 6W heat (60W continous and 90% eff.) will be 84 degree C over ambient, and with 10W 140 degree C over ambient on top of chip.
Should I use the surface heat and use 84+20 degree? or should I lower the volume power in simulation until I get TI suggestion on surface temp on top of chip at this power.
And after this a CFD to test with airflow?