I think i might need some help…
I am currently trying to simulate the temperature distribution in a battery modul.
I assigned the volume cell dummies as a heat source and set the thermal resistance of the thermal interface material, a gap pad, as a contact resistance.
now i dont want to simulate the fluid flow within the cooling channels so i used basic fluid mechanics to calculate the heat conductance. my thought was, that i use a wall boundry condition, assign the conductance and give the average fluid temparature on the boundry.
But how do i specifiy the wall boundry condition correctly?
And do you have a better idea to solve this problem?
My current results ranged from -4000 K to + 4000 K
hope the link works