Hi,
I’m comparing die temperature according to heat dissipation when the heat sink is attached to the LCoS panel substrate and when the heat sink is attached directly to the silicon DIE after removing some area of the substrate(removing some Substrate/FPCB/other acrylic tapes) from the LCoS panel.
I think the model with direct heatsink attached to the die should have a lower temperature than with heatsink attached to the substrate, but the simulation results are not.
HeatSink attached on substrate : HT_RDP370FR+HeatSink
HeatSink attached on die directly : HT_RDP370FR+Hole+HeatSink
Here is the project link beblow
RDP370FR | SimScale Workbench
Regarding this, please comment on whether the simulation setting is wrong or if there are other factors.
Thank you,
Jake