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Thermal modeling of the output MOSFET heatsinking using combination of cooper pour and vias
toddh created this project
over 2 years ago
Thermal modeling of the output MOSFET heatsinking using combination of cooper pour and vias
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
by ahmedhussain18ahmedhussain18
by TemplatesTemplates