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Thermal-Mechanical Analysis and Heat Sink Optimization of a High-Power Electronics Module

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FEA-based thermal and structural analysis of a high-power electronics module to evaluate temperature distribution, thermal deformation, and stress, followed by heat sink design optimization.

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Thermal-Mechanical Analysis and Heat Sink Optimization of a High-Power Electronics Module

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Thermal-Mechanical Analysis and Heat Sink Optimization of a High-Power Electronics Module

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