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Project Varuna v4.0 - High-Density Thermal Validation
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1 Geometry 1 Mesh 1 Simulation setup 0 ResultsAbout this project
Computational Fluid Dynamics (CFD) simulation to validate Project Varuna’s indigenous Zone C architecture. This study tests Layer 3 (Direct-to-Chip liquid cooling using BPCL VarCool-32 dielectric fluid) and Layer 4 (Rear-Door Heat Exchangers) in high-density AI superclusters. The goal is to prove stable junction temperatures below 90°C at extreme 200 kW/rack densities under 45°C ambient Indian summer conditions, achieving a targeted facility PUE of 1.15-1.18.
