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Conjugate heat transfer of a minimal aluminum enclosure for an OV5640 camera module. PCB 18x12 mm, ambient 35C, target: keep external surface below EN ISO 13732-1 / IEC 62368-1 burn limits. Measured baseline surface temp 44C indoors no AC. Geometry: 28x22x20 mm aluminum housing with Phi8 mm lens hole on +Y face, 5 top cooling fins, internal 12x8x3 mm thermal boss for PCB heat conduction.
narrokhan created this project
20 days ago