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CPU_Cooling_Simulation
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1 Geometry
1 Mesh
2 Simulation setups
0 Results
1 Geometry 1 Mesh 2 Simulation setups 0 ResultsAbout this project
Thermal analysis of a CPU (52x45x5 mm) mounted on a 2 mm PCB. Heat load: 140W. Goal: Keep CPU temperature below 80°C (Ambient 20°C). Optimization of heatsink geometry (Al/Cu) to balance cooling efficiency and material usage.
