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0 ResultsGoal: Evaluate a passive multi-path thermal routing system for AI power electronics. Simulation type: Thermal / heat transfer simulation comparing switch-open and switch-closed configurations. Details: The model uses a central heated copper block, one always-active cooling path, and a secondary heat path activated through a passive thermal switch. The study will compare maximum temperature, thermal resistance, and heat distribution at 100 W, 200 W, and 300 W.
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
damdooma_13 created this project
4 days ago
1 Geometry 1 Mesh 1 Simulation setup 0 ResultsGoal: Evaluate a passive multi-path thermal routing system for AI power electronics. Simulation type: Thermal / heat transfer simulation comparing switch-open and switch-closed configurations. Details: The model uses a central heated copper block, one always-active cooling path, and a secondary heat path activated through a passive thermal switch. The study will compare maximum temperature, thermal resistance, and heat distribution at 100 W, 200 W, and 300 W.
