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1 Geometry
1 Mesh
0 Simulation setups
0 ResultsConducted a 3D CFD investigation of V-shaped ribbed microchannel heat sinks for high-heat-flux electronics cooling. Modeled channel geometry in PTC Creo Parametric, meshed in ANSYS Workbench (tetrahedral mesh with boundary-layer inflation), and simulated in ANSYS Fluent under laminar flow (Re 100–900) with water as coolant and silicon as substrate. Validated the numerical model against published benchmark data (Naushad Ali et al., 2025) across five rib attack angles, achieving good agreement in Nusselt number, friction factor, and base temperature. Extended the study with parametric case analyses comparing rib cross-section geometries (semi-cylindrical, triangular, conical) and rib pitch variation (0.2–0.8mm). Identified an optimized configuration (triangular ribs, 0.2mm pitch, 35° attack angle) delivering a 22% improvement in thermohydraulic performance parameter (THPP = 6.26) over the benchmark design, demonstrating a viable enhancement strategy for energy-efficient electronic cooling.
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by ahmedhussain18ahmedhussain18
by TemplatesTemplates
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
bhoomikahi01 created this project
9 days ago
1 Geometry 1 Mesh 0 Simulation setups 0 ResultsConducted a 3D CFD investigation of V-shaped ribbed microchannel heat sinks for high-heat-flux electronics cooling. Modeled channel geometry in PTC Creo Parametric, meshed in ANSYS Workbench (tetrahedral mesh with boundary-layer inflation), and simulated in ANSYS Fluent under laminar flow (Re 100–900) with water as coolant and silicon as substrate. Validated the numerical model against published benchmark data (Naushad Ali et al., 2025) across five rib attack angles, achieving good agreement in Nusselt number, friction factor, and base temperature. Extended the study with parametric case analyses comparing rib cross-section geometries (semi-cylindrical, triangular, conical) and rib pitch variation (0.2–0.8mm). Identified an optimized configuration (triangular ribs, 0.2mm pitch, 35° attack angle) delivering a 22% improvement in thermohydraulic performance parameter (THPP = 6.26) over the benchmark design, demonstrating a viable enhancement strategy for energy-efficient electronic cooling.
