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1 Geometry
2 Meshes
2 Simulation setups
1 ResultThermal simulation and conjugate heat transfer (CHT) analysis of a 4-layer 2-channel industrial smart eFuse board. The primary objective of this simulation is to evaluate the steady-state thermal behavior and estimate the junction temperatures of the high-side power MOSFETs and shunt resistors under maximum continuous load conditions. The analysis also monitors the thermal performance of the XL1509 buck converter stage. The simulation validates the PCB's thermal relief design, copper plane heat-sinking capabilities, and natural convection efficiency without active cooling.
Xenog created this project
14 days ago
1 Geometry 2 Meshes 2 Simulation setups 1 ResultThermal simulation and conjugate heat transfer (CHT) analysis of a 4-layer 2-channel industrial smart eFuse board. The primary objective of this simulation is to evaluate the steady-state thermal behavior and estimate the junction temperatures of the high-side power MOSFETs and shunt resistors under maximum continuous load conditions. The analysis also monitors the thermal performance of the XL1509 buck converter stage. The simulation validates the PCB's thermal relief design, copper plane heat-sinking capabilities, and natural convection efficiency without active cooling.
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
by ahmedhussain18ahmedhussain18
by TemplatesTemplates
