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To evaluate different Heatsink mounting orientations.

Todas las aletas con 25 mm de longitud externa y 20mm de altura de aleta

Thermal analysis of an active heatsink to cool a microprocessor

Looking at flow and heat transfer through curved heat sink shapes. Conjugate heat transfer and incompressible flow. Radial inlets and axial outlets (probably).

My first attempt at heatsink Design and Validation

Simulation of heat sink, with rectangular fins and tapered one's.

A CHT simulation of a generic PLUSPak247-cased linear Power MOSFET on a near 'infinite' heatsink (1m x1m x 0.1m, high thermal conductivity of 1e+6W/m.K). 

The  10mm x 10mm x 0.2mm silicon die (chip) is bonded to the copper tab with a bonding material of similar dimensions whose thermal conductivity is then empirically adjusted  to make the overall Tjc equal to 0.12W/m.K.

The model MOSFET 2can then be used in a subsequent simulation of 6 or 8 devices on a forced-air cooled finned and enclosed heatsink.

To simulate heatsink and losses of our system

Thermal analysis of LM741 in a Square Wave Generator circuit

Checking Heatsink behaviour with IGBT mounted

Test thermal characteristics of cone shaped heatsink.

The goal of this project is to simulate the simplified version of the cooling system of the HP Workstation Notebook.
This is a Conjugate Heat Transfer (CHT) problem. Incompressible turbulent flow was assigned for the air flow. Two cooling scenarios are going to be investigated
1- Current cooling system 
2- External cooling fan assisted system

Simulation of led pcb heat sink
thermal description
led thermal management system

Fan efficiency analysis of Notebook heat extraction system
(Incompressible flow simulation)

Test enclosure heat sink ability with fins.

Comparison cooling of a simple flat panel.

Test out what kind of heatsink is required for convection cooling of an electronics board.

Model convection heat sinking of an auxillary board.

heatsink | SimScale Project Library | Page 1