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Fan forced convection cooling of an EV battery pack

Demonstration project of an electronics enclosure using CHT v2. Comparison different passive heat sink designs and comparison of active and passive cooling

influence of temperature on electronic components
simulation of temperature

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A project that tests a detailed thermal model of a simple component in a test environment to create a network resistance model to be validated in the same environment. The project aims at providing a basis for thermal characterisation of other components, and to show how the resistance model is implemented and used in SimScale.

This project deals with simulating the flow through the graphic card at different fan Rpms using the Multiple reference frame(MRF) rotational zone concept. A conjugate heat transfer analysis will be performed to keep a check on thermal throttling of the GPU.

Electronic cooling is a vastly important topic, as failure to sufficiently cool a component within a system will lead to overheating, reducing the component's lifespan or in severe cases damaging the component.

Water cooling is a great option for higher power application, and this webinar will demonstrate how CFD can be used to ensure that there is sufficient cooling, and how to ensure its efficiency within a system.

This it sample testing of electronic project

First simulation of heat transfer on a LM7805

The cooling of a dense packaging of electronics (about 100W) inside an enclosure is simulated.