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2D chip Heat Model
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0 Geometries 0 Meshes 1 Simulation setup 0 ResultsAbout this project
A simple two-layer thermal model for a processor. Layer 1 os the silicon die and layer 2 is heat spreader. To model heat sink we have placed an isothermal layer (maintained at the ambient temperature ) on the top of the heat spreader.
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Project History
svarshney created this project