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Heat Sink Fin Design for Electronics Cooling - Copy - Copy
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Statistics
1 Geometry
1 Mesh
2 Simulation setups
1 Result
1 Geometry 1 Mesh 2 Simulation setups 1 ResultAbout this project
Objective: Optimize fin geometry for maximum heat dissipation. Geometry: • Baseplate: 0.1 m × 0.1 m × 0.005 m. • Rectangular fins: 0.08 m height, 0.002 m thickness. • Pin fins: Cylindrical (diameter = 0.003 m, height = 0.08 m). Material: Aluminum (k = 160 W/m·K). Boundary Conditions: • Heat source: 100 W applied to baseplate. • Convective cooling (h = 25 W/m²·K, T_ambient = 25°C). Analysis Steps (SimScale): 1. Steady-state thermal analysis. 2. Parametric study on fin spacing (5 mm vs. 10 mm). 3. Evaluate thermal resistance Rth=Tmax−TambientQRth=QTmax−Tambient. Deliverables: • Temperature contour plots. • Heat flux magnitude in fins. • Comparison of thermal resistance for fin types. - Copy - Copy
