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3 Geometries
4 Meshes
1 Simulation setup
1 ResultThe presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects drive the flow in the surrounding air. The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out. - Copy
by simscalesimscale
3 Geometries 4 Meshes 1 Simulation setup 1 ResultThe presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects drive the flow in the surrounding air. The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out. - Copy
Jon_Wilde created this project
over 7 years ago
rmboyer5555 copied this project
9 days ago
