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Validation Case: Heat transfer in an Electronics Design - Copy
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1 Geometry
2 Meshes
2 Simulation setups
1 Result
1 Geometry 2 Meshes 2 Simulation setups 1 ResultAbout this project
Validation project: Heat transfer analysis of a high-power IC package containing die, thermal interface material, lid and heatsinks. - Copy
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by simscalesimscale
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simscale created this project
msanjabi copied this project