Set up your own cloud-native simulation in minutes.Start Simulating Now
0
0
1 Geometry
1 Mesh
1 Simulation setup
1 ResultValidation project: Heat transfer analysis of a high-power IC package containing die, thermal interface material, lid and heatsinks. - Copy
by simscalesimscale
1 Geometry 1 Mesh 1 Simulation setup 1 ResultValidation project: Heat transfer analysis of a high-power IC package containing die, thermal interface material, lid and heatsinks. - Copy
simscale created this project
almost 6 years ago
mnegus copied this project
3 months ago
