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Heat Sink + Power Source 2
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2 Geometries
1 Mesh
1 Simulation setup
8 Results
2 Geometries 1 Mesh 1 Simulation setup 8 ResultsAbout this project
Analysis using CHT of a Heat Sink with some semiconductors attached to it, both cooled with a fan whose curve pressure-CFM is given as a boundary condition. Thermal problem is performed and simulated, focusing on main temperature fields, power dissipation and possible export to ParaView for suitable post-processing.
