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Heat Sink + Power Source
440
0
Statistics
2 Geometries
2 Meshes
1 Simulation setup
2 Results
2 Geometries 2 Meshes 1 Simulation setup 2 ResultsAbout this project
Analysis using CHT of a Heat Sink with some semiconductors attached to it, both cooled with a fan whose curve pressure-CFM is given as a boundary condition. Thermal problem is performed and simulated, focusing on main temperature fields, power dissipation and possible export to ParaView for suitable post-processing.
