Explore agentic engineering workflow on SimScaleExperience Engineering AI
The mean goal of this project is knowing the behaviour of the heat transfer among a PCB and 3 components and analyze the benefits of using thermal vias. A CHT simulation will be used as well as a Laminar turbulence model and a Steady-State time dependency. This is a school project.
by simscalesimscale
YohanCurbelo created this project
about 7 years ago