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1 Geometry
0 Meshes
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0 ResultsThermal validation of a custom IP67 sealed outdoor electronics enclosure with integrated passive heatsink. Study focuses on natural convection and conduction cooling of a vertically mounted circuit card assembly dissipating 30–35 W nominal and 67 W peak across –40°C to +55°C ambient with solar loading consideration. Objective is to evaluate heatsink feasibility, component temperature rise, and passive cooling performance for final thermal/mechanical design.
by mwavinyamwavinya
by ahmedhussain18ahmedhussain18
by ahmedhussain18ahmedhussain18
by ahmedhussain18ahmedhussain18
dehbola created this project
4 months ago
1 Geometry 0 Meshes 0 Simulation setups 0 ResultsThermal validation of a custom IP67 sealed outdoor electronics enclosure with integrated passive heatsink. Study focuses on natural convection and conduction cooling of a vertically mounted circuit card assembly dissipating 30–35 W nominal and 67 W peak across –40°C to +55°C ambient with solar loading consideration. Objective is to evaluate heatsink feasibility, component temperature rise, and passive cooling performance for final thermal/mechanical design.
