Conjugate Heat Transfer (IBM)

Conjugate heat transfer (IBM) is a very robust method to simulate flow and heat transfer in complex CAD assemblies. It solves the same physics as Conjugate Heat Transfer v2.0 but immerses the CAD parts in a Cartesian background grid (Immersed Boundary Method) avoiding to resolve all parts in an exact way during meshing (body-fitted). It therefore is resilient to undesired details that are insignificant for the overall thermal behavior. It is particularly suited for early stage design studies on complex CAD assemblies like system-level electronics cooling or HVAC applications. Learn more. | Page 31

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). 
IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation
In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on. - Copy

A structurer for heat transfer to thermoelectric plate

Simulation of Heat Transfer for Ind. Study

Ran a transient CHT study with the IBM solver. Tried to figure out how long I have to wait without pouring cold water over the boiled egg until it's at a good temperature to eat. Also checked which temperature the boiled egg has after 10 minutes to intialize the cooling run. Thermal properties taken and comparison done to this amazing paper from university of Osnabrück.

un boîtier ouvert pour moins de turbulences

We’re comparing two different heat sink designs for an LED lamp with respect to their heat dissipation effectiveness. The LED itself is not visible, but from only seeing the heat sink temperature, can you spot which one performs better and why?

The goal of this project is to simulate the simplified version of the cooling system of the HP Workstation Notebook.
This is a Conjugate Heat Transfer (CHT) problem. The incompressible turbulent flow was assigned for the airflow. 2 cooling scenarios are going to be investigated
1- Default internal cooling
2- External cooling by a fanned thermal pad

Demo template for cooling of Raspberry Pi using IBM solver. Power consumption of CPU is 6 W, worst case scenario when overclocking, see https://www.pidramble.com/wiki/benchmarks/power-consumption. Fan is defined with average velocity.

Thermal Management of a Personal Computer