Electronics & High Tech

From electronic chips and printed circuit boards (PCBs) to smartphones or computers, SimScale is the perfect tool for electronics simulation, enabling companies to ensure power optimization, durability, efficiency or thermal performance for their products. | Page 46

Tutorial project for a thermal analysis of a differential casing. The project only provides the geometry to start with. See our tutorials section to have a look at the step-by-step instructions to set up the simulation.

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out. - Copy