This project shows the thermal effect of the electronic chips mounted on a printed circuit board (PCB). The geometry of the PCB was created on Onshape and then imported to SimScale platform.
The geometry was meshed using parametrized tetrahedralization on SimScale platform. The mesh is shown in the figure below.
Transient heat transfer was selected as an analysis type since temperature and surface heat flux was assumed to change over time. The red highlighted area represents the total of nine electronic chips mounted on this PCB. Maximum power dissipation for all the chips were considered as follows:
- Chip 1: 0.5 W
- Chips 2/4/5: 0.3 W
- Chips 8/9, 0.2 W
- Chip 3: 0.1 W
- Chips 6/7: 0.04 W
These total power dissipation were provided via table upload through volume heat source boundary condition. Furthermore, the change in ambient temperature of convective heat flux over time was also considered. The simulation was run for 200 seconds (~2 minutes). The figure below shows the temperature and heat flux on the chips and PCB from top and bottom.
Finally, the figure below shows the animation of the final result.