About the Project
This project contains an analysis of a heat sink used for cooling electronics.
In this case we have the air flow at room temperature, 2 heated electronic chips and a heat sink at an intermediate temperature. The geometry is as shown below.
The Hex-dominant Parametric (only CFD) mesh was used to generate the mesh for the 4 volumes (3 solids and 1 fluid). This is used to create refinements and maintain the volumes as different regions to later define interfaces. At the end of meshing we have 4 different regions.
A laminar steady-state simulation is carried out using the ‘Conjugate Heat Transfer’ solver. The following pictures show some post-processing performed on SimScale platform and also locally using ParaView.
Contour of temperature:
Streamlines - temperature:
Streamlines - velocity: