I created a new simulation project called 'Heat dissipation of connector plate with UNO type Industrial computer attached':
Investigate heat transfer from on board industrial computer which is housed in a finned aluminium enclosure to the connector plate. Initially with natural convection establish at what ambient temperature fining would be required to be applied to the external face of the connector plate. Establish at what ambient temperature forced convection is required. Max temperature of aluminium enclosure 60 degrees C, heat dissipation 20 Watts max
More of my public projects can be found here.