Hi folks,
I’m trying to simulate a heat sink to see what size and parameters would be good starting point for the actual build.
I’ve spent a bit of time browsing through demo projects and have tried to replicate the techniques I’ve seen, but so far no luck. I keep running into issues where a “velocity field started diverging” or a “temperature field started diverging”. On one run the device temperature began to climb gradually (up to a very realistic point) then shortly after started going down and errored out. I’ve tried messing with most of the mesh settings which ultimately ends in a meshing failure, often “ran out of memory”. I’ve got result control on the device temp and on the air outlet. I’ve also tried this with a few different variations of the CAD model with exactly the same errors.
The model consists of the heat sink, a mock up of the device generating the heat (an LDMOS transistor), and a shroud to direct the airflow. Based on my testing with these LDMOS devices I’ve determined that a skived copper heat sink is my best chance to maintain a safe junction temperature without going to water cooling or heat pipes.
I estimate that the device will generate up to around 750w of heat, and that the case temperate should be no higher than 120degC.
I’m very new to this type of modelling so any tips are appreciated. Thanks!