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Electronics Optimization with SimScale

Electronics optimization SimScale Chip

Electronics optimization based on SimScale multiple analysis can help electronics engineers to solve a wider range of problems as well as deal with more complex scenarios.

Dynamic and static stress analyses could be performed for mechanical components or cases structures. Fluid flow and multi-component thermal analysis are common simulation methods for electronics components like chips, diodes, resistors or electronic boards, controlling thermal behavior of different materials, cooling effects and environmental influences.

From electronic chips and printed circuit boards (PCBs) to smartphones or computers, SimScale is offering the perfect tools for electronics optimization and simulation, enabling companies to ensure power optimization, durability, efficiency or thermal performance for their products.

Let’s see how SimScale can help you produce better devices, starting from the fundamental product classifications in electronics optimization by engineering analysis: Components, Board, and System.

Electronics Optimization for Components

Electronics optimization: SimScale LED

Cooling heat sink

A major challenge in electronics production is to ensure that components operate at temperatures below their established limits. As component power increases and packaging sizes decrease, designing to ensure adequate cooling becomes critical and challenging.

In SimScale Public Projects library we can find a relevant example in the cooling of a heat sink with natural convection analysis.

In this project, a LED with light emission on 24 W power is assumed. A steady state heat transfer analysis was carried out to determine the operating temperature of the LED. The temperature of the LED is important for its lifetime and can by altered by changing the geometry of the heat sink. The heat flux and temperature field images are helping to find better model.

Other SimScale interesting project is related to a chip thermostructural analysis. 

Electronics optimization: Simscale chip 2

Chip thermostructural analysis

Electronic chips are commonly used in wide range of electronic circuits. Power loss normally occurs in these chips due to the rise in temperature which decreases their efficiency. This project shows the thermostructural analysis for an 8 pin Small-Outline Integrated Circuit (SOIC) chip with applied heat flux on the main chip core surfaces. A ceramic material was selected for the chip, and copper was selected for the pins. A convective heat flux of 18 W/(m² K) was applied on all the outer faces of the chip. The final model figures shows the temperature, heat flux and vonMises stress produced in the chip. One project conclusion is a power loss of only 0.16 W can lead to a 516 K (243 °C) temperature increase.

Printed Circuit Board Simulation

In many board-level simulation analyses, the objective is to assess the temperature rise within a Printed Circuit Board (PCB) due to Joule heating. This involves traces modelling, a difficult process when a CAD model of the trace layout is not usually available.

A nice example is the SimScale transient thermal analysis of a printed circuit board (PCB).

SimScale PCB 1

PCB with 9 chips

SimScale PCB 2

Temperature for chips and PCB

This project shows the thermal effect of the electronic chips mounted on a Printed Circuit Board (PCB). The geometry of PCB was created on Onshape and imported to the SimScale platform. Transient heat transfer was selected as an analysis type since temperature and surface heat flux was assumed to change over time. Chips 3,6,7,8 and 9 were given a temperature changing over time by uploading data tables. Chips 1,2,4 and 5 were given surface heat flux changing over time by also uploading data tables. The simulation figures show the temperature and heat flux on chips and PCB from top and bottom side.

Electronic Systems Simulation

System-level simulations are based on multiple components analyses, coming in different configurations. A good example of SimScale system analysis is the structural stress analysis of a mobile phone casing tested for a 2 meters height drop.

SimScale Phone

Phone casing drop test

This project shows how the electronic consumer industry can leverage SimScale to design better products. The drop of a mobile phone casing falling from two meters height is simulated to see whether or not it reaches critical stress values.

The dynamic finite element analysis type is used for this simulation. The mobile phone is placed directly above the ground and initiated with a downwards velocity. VonMises stress figure is one of the result of this modelling.

 


All the projects presented in this article can be imported into your own workspace and used as templates. Feel free to browse the SimScale Public Projects for other interesting simulations.

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